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M
Features
* * * *
TC4421/TC4422
Package Type
TO-220-5 8-Pin PDIP/CERDIP
VDD 1 INPUT 2 8 VDD
9A High-Speed MOSFET Drivers
Applications
* * * * * Line Drivers for Extra-Heavily-Loaded Lines Pulse Generators Driving the Largest MOSFETs and IGBTs Local Power ON/OFF Switch Motor and Solenoid Driver
NC = No connection NOTE: Duplicate pins must both be connected for proper operation.
General Description
The TC4421/TC4422 are high current buffer/drivers capable of driving large MOSFETs and IGBTs. They are essentially immune to any form of upset except direct overvoltage or over-dissipation - they cannot be latched under any conditions within their power and voltage ratings; they are not subject to damage or improper operation when up to 5V of ground bounce is present on their ground terminals; they can accept, without either damage or logic upset, more than 1A inductive current of either polarity being forced back into their outputs. In addition, all terminals are fully protected against up to 4kV of electrostatic discharge. The TC4421/TC4422 inputs may be driven directly from either TTL or CMOS (3V to 18V). In addition, 300mV of hysteresis is built into the input, providing noise immunity and allowing the device to be driven from slowly rising or falling waveforms.
Device Selection Table
Part Number TC4421CAT TC4421CPA TC4421EPA TC4421MJA TC4422CAT TC4422CPA TC4422EPA TC4422MJA Package 5-Pin TO-220 8-Pin PDIP 8-Pin PDIP 8-Pin CERDIP 5-Pin TO-220 8-Pin PDIP 8-Pin PDIP 8-Pin CERDIP Temp. Range 0C to +70C 0C to +70C -40C to +85C -55C to +125C 0C to +70C 0C to +70C -40C to +85C -55C to +125C
Functional Block Diagram
Inverting VDD
300mV Output
Input 4.7V
Noninverting
TC4421/TC4422 Inverting/Noninverting
GND Effective Input C = 25pF
2002 Microchip Technology Inc.
INPUT GND VDD GND OUTPUT
Tough CMOS Construction High Peak Output Current: 9A High Continuous Output Current: 2A Max Fast Rise and Fall Times: - 30nsec with 4,700pF Load - 180nsec with 47,000pF Load * Short Internal Delays: 30nsec Typ. * Low Output Impedance: 1.4 Typ.
TC4421 TC4422
Tab is Common to VDD
NC 3 GND 4
TC4421 TC4422
7 OUTPUT 6 OUTPUT 5 GND
DS21420B-page 1
TC4421/TC4422
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage .....................................................+20V Input Voltage .................... (VDD + 0.3V) to (GND - 5V) Input Current (VIN > VDD) ....................................50mA Package Power Dissipation (TA 70C) PDIP .........................................................730mW CERDIP....................................................800mW 5-Pin TO-220................................................1.6W Package Power Dissipation (TA 25C) 5-Pin TO-220 (With Heatsink) ....................12.5W Derating Factors (To Ambient) PDIP ........................................................8mW/C CERDIP................................................6.4mW/C 5-Pin TO-220.........................................12mW/C Thermal Impedances (To Case) 5-Pin TO-220 RJ-C ..................................10C/W Operating Temperature Range (Ambient) C Version......................................... 0C to +70C E Version ......................................-40C to +85C M Version ...................................-55C to +125C Storage Temperature Range ..............-65C to +150C
TC4421/TC4422 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25C, with 4.5V VDD 18V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO RO IPK IDC IREV High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Continuous Output Current Latch-Up Protection Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time
1: Switching times ensured by design.
Parameter
Min
Typ
Max
Units
Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
2.4 -- -10 VDD - 0.025 -- -- -- -- 2 --
1.8 1.3 -- -- -- 1.4 0.9 9 -- >1.5
-- 0.8 10 -- 0.025 -- 1.7 -- -- --
V V
A
0V VIN VDD Figure 3-1 Figure 3-1 IOUT = 10mA, VDD = 18V IOUT = 10mA, VDD = 18V VDD = 18V 10V VDD 18V, TA = +25C (TC4421/TC4422 CAT only) Duty cycle 2%, t 300sec
V V

A A A
Switching Time (Note 1) tR tF tD1 tD2
Note
-- -- -- --
60 60 30 33
75 75 60 60
nsec nsec nsec nsec
Figure 3-1, CL = 10,000pF Figure 3-1, CL = 10,000pF Figure 3-1 Figure 3-1
DS21420B-page 2
2002 Microchip Technology Inc.
TC4421/TC4422
TC4421/TC4422 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = +25C, with 4.5V VDD 18V, unless otherwise noted. Symbol Power Supply IS VDD Symbol Input VIH VIL IIN Output VOH VOL RO RO tR tF tD1 tD2 IS VDD
Note 1:
Parameter
Min
Typ
Max
Units
Test Conditions
Power Supply Current Operating Input Voltage
-- -- 4.5
0.2 55 --
1.5 150 18
mA A V
VIN = 3V VIN = 0V
Electrical Characteristics: Over operating temperature range with 4.5V VDD 18V, unless otherwise noted. Parameter Min Typ Max Units Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Rise Time Fall Time Delay Time Delay Time Power Supply Current Operating Input Voltage
Switching times ensured by design.
2.4 -- -10 VDD - 0.025 -- -- -- -- -- -- -- -- -- 4.5
-- -- -- -- -- 2.4 1.8 60 60 50 65 0.45 0.06 --
-- 0.8 10 -- 0.025 3.6 2.7 120 120 80 80 3 0.2 18
V V
A
0V VIN VDD Figure 3-1 Figure 3-1 IOUT = 10mA, VDD = 18V IOUT = 10mA, VDD = 18V Figure 3-1, CL = 10,000pF Figure 3-1, CL = 10,000pF Figure 3-1 Figure 3-1 VIN = 3V VIN = 0V
V V

Switching Time (Note 1) nsec nsec nsec nsec mA V
Power Supply
2002 Microchip Technology Inc.
DS21420B-page 3
TC4421/TC4422
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin PDIP, CERDIP) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol VDD INPUT NC GND GND OUTPUT OUTPUT VDD Supply input, 4.5V to 18V. Control input, TTL/CMOS compatible input. No Connection. Ground. Ground. CMOS totem pole output. CMOS totem pole output. Supply input, 4.5V to 18V. Description
Pin No. (5-Pin TO-220) 1 2 3 4 5
Symbol INPUT GND VDD GND OUTPUT
Description Control input, TTL/CMOS compatible input. Ground. Supply input, 4.5V to 18V. Ground CMOS totem pole output.
DS21420B-page 4
2002 Microchip Technology Inc.
TC4421/TC4422
3.0 APPLICATIONS INFORMATION
SWITCHING TIME TEST CIRCUITS
VDD = 18V
FIGURE 3-1:
0.1F
1 8
+5V
90%
Input 0.1F
2 6 7
0.1F
0V
10%
tD1
90%
tF
tD2
Input
Output
+18V
tR
90%
Output CL = 10,000pF
0V 10% 10%
TC4421
4 5
Input: 100kHz, square wave, tRISE = tFALL 10nsec
2002 Microchip Technology Inc.
DS21420B-page 5
TC4421/TC4422
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Rise Time vs. Supply Voltage
220 200 180 160 tRISE (nsec) 140 120 100 80 60 40 20 0 4 6 8 10 12 VDD (V) 14 16 18 10,000pF 4700pF 1000pF 22,000pF
tFALL (nsec)
180 160 140
Fall Time vs. Supply Voltage
22,000pF 120 100 80 60 4700pF 40 20 1000pF 0 4 6 8 10 12 VDD (V) 14 16 18 10,000pF
Rise TIme vs. Capacitive Load
300 5V 250 10V
tFALL (nsec)
250 300
Fall TIme vs. Capacitive Load
5V 10V 200 150 15V 100 50 0 100
tRISE (nsec)
200 150 15V 100 50 0 100
1000
10,000 CLOAD (pF)
100,000
1000
10,000 CLOAD (pF)
100,000
Rise and Fall Times vs. Temperature
90 80 70 60
Propagation Delay vs. Supply Voltage
50
CLOAD = 1000pF
CLOAD = 10,000pF VDD = 15V
45 TIME (nsec)
TIME (nsec)
40
tRISE
50 40 30
35
tD1
tD2
tFALL
30
-40
0
40
TA (C)
80
120
25
4
6
8
10
12
14
16
18
VDD (V)
DS21420B-page 6
2002 Microchip Technology Inc.
TC4421/TC4422
TYPICAL CHARACTERISTICS (CONTINUED)
Supply Current vs. Capacitive Load
220 200 180 160
ISUPPLY (mA)
VDD = 18V
180 160 140
ISUPPLY (mA)
VDD = 18V 47,000pF
Supply Current vs. Frequency
22,000pF
2MHz
10,000pF
140 120 100 80 60 40 20 0 100 1000 10,000 CLOAD (pF) 100,000 632kHz 200kHz 20kHz 1.125MHz 63.2kHz
120 100 80 60 40 20 0 10 470pF 100 FREQUENCY (kHz) 1000 4700pF 0.1F
Supply Current vs. Capacitive Load
180 160 140
ISUPPLY (mA)
VDD = 12V
Supply Current vs. Frequency
180 160 140
ISUPPLY (mA)
VDD = 12V
22,000pF 10,000pF 47,000pF
120 100 80 60 40 20 0 1.125MHz 632kHz 200kHz 2MHz 63.2kHz
120 100 80 60 40 0.1F 4700pF
20kHz
20 0
470pF 10 100 FREQUENCY (kHz) 1000
100
1000
10,000 CLOAD (pF)
100,000
Supply Current vs. Capacitive Load
100 90 80 70 60 50 40 30 20 10 0 100 1000 10,000 CLOAD (pF)
20kHz 2MHz 632kHz 63.2kHz
VDD = 6V
Supply Current vs. Frequency
120
VDD = 6V
200kHz
47,000pF 22,000pF
100 80 4700pF 60 40 0.1F 20 470pF
100,000
ISUPPLY (mA)
ISUPPLY (mA)
10,000pF
0 10
100 FREQUENCY (kHz)
1000
2002 Microchip Technology Inc.
DS21420B-page 7
TC4421/TC4422
TYPICAL CHARACTERISTICS (CONTINUED)
Propagation Delay vs. Input Amplitude
120 110 100 90 TIME (nsec) 70 60 50 40 30 20 10 0 1 2 3 4 5 6 INPUT (V) 7 8 9 10
20 -60 -40 -20 0 20 40 TA (C) 60 80 100 120 TIME (nsec) 50
Propagation Delay vs. Temperature
VDD = 18V CLOAD = 10,000pF VIN = 5V
VDD = 10V CLOAD = 10,000pF
45 40 35
80
tD2 tD1
tD2
30 25
tD1
10-6
Crossover Energy vs. Supply Voltage
Quiescent Supply Current vs. Temperature
103
VDD = 18V
10-7
IQUIESCENT (A)
A*sec
INPUT = 1
102
INPUT = 0
10-8 4 6 8 10 12 VDD (V) 14 16 18
-60 -40 -20
0
20
40
60
80 100 120
NOTE: The values on this graph represent the loss seen by the driver during a complete cycle. For the loss in a single transition, divide the stated value by 2.
TJ (C)
High-State Output Resistance vs. Supply Voltage
6 5.5 5 4 3.5 3 2.5 2 1.5 1 0.5 4 6 8 10 12 VDD (V) 14 16 18
TJ = 25C
Low-State Output Resistance vs. Supply Voltage
6 5.5 5 4.5
RDS(ON) ()
4.5
RDS(ON) ()
TJ = 150C
4 3.5 3 2.5 2 1.5 1 0.5 4 6 8 10 12 VDD (V) 14 16 18
TJ = 25C TJ = 150C
DS21420B-page 8
2002 Microchip Technology Inc.
TC4421/TC4422
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21420B-page 9
TC4421/TC4422
Package Dimensions (Continued)
8-Pin CERDIP (Narrow)
.110 (2.79) .090 (2.29) PIN 1
.300 (7.62) .230 (5.84)
.055 (1.40) MAX. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18)
.020 (0.51) MIN. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41)
Dimensions: inches (mm)
.150 (3.81) MIN.
3 MIN.
5-Pin TO-220
.185 (4.70) .165 (4.19) .117 (2.97) .103 (2.62) .415 (10.54) .390 (9.91) .156 (3.96) .140 (3.56) DIA. .055 (1.40) .045 (1.14)
.293 (7.44) .204 (5.18) .613 (15.57) .569 (14.45) 3 - 7.5 5 PLCS.
.590 (14.99) .482 (12.24)
.037 (0.95) .025 (0.64) .025 (0.64) .012 (0.30) .072 (1.83) .062 (1.57) .273 (6.93) .263 (6.68) .115 (2.92) .087 (2.21)
PIN 1
Dimensions: inches (mm)
DS21420B-page 10
2002 Microchip Technology Inc.
TC4421/TC4422
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21420B-page11
TC4421/TC4422
NOTES:
DS21420B-page12
2002 Microchip Technology Inc.
TC4421/TC4422
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21420B-page 13
M
WORLDWIDE SALES AND SERVICE
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' !$ '
DS21420B-page 14
2002 Microchip Technology Inc.

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